ADJUSTMENT METHOD, SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS, EXPOSURE APPARATUS, INSPECTION APPARATUS, MEASUREMENT AND/OR INSPECTION SYSTEM, PROCESSING APPARATUS, COMPUTER SYSTEM, PROGRAM AND INFORMATION RECORDING MEDIUM

摘要

When a host issues an analysis order that specifically instructs the analytical contents to an analytical apparatus (step 401), the analytical apparatus collects two types of measurement and/or inspection results from a measurement and/or inspection instrument (steps 403 to 409), and in step 411, the analytical apparatus analyzes the measurement and/or inspection results and optimizes processing conditions of a series of processes related to wafer W. In step 411, data related to a processing state of a processing apparatus is acquired from the processing apparatus as needed. In step 413, the measurement and/or inspection results and the optimization results are accumulated in a database, and the optimization results are transmitted to various processing apparatuses (including the measurement and/or inspection instrument). After that, the analytical apparatus sends a processing end notice to the host (step 417).