| 发明名称 |
Optoelectronic semiconductor device has housing having main portion that is formed with recess for mounting optoelectronic semiconductor chip, where main portion is made of silicon material |
| 摘要 |
<p>The semiconductor device (1) has a housing (2) having a main portion (3) that is formed with a recess (4), and a connection carrier (5) that is arranged with terminal support portions (5a,5b). An optoelectronic semiconductor chip (7) is provided in the recess of main portion on the connection carrier. A stiffening structure (8) is formed on the main portion made of silicon material.</p> |
| 申请公布号 |
DE102010052541(A1) |
申请公布日期 |
2012.05.31 |
| 申请号 |
DE20101052541 |
申请日期 |
2010.11.25 |
| 申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
JAEGER, HARALD;BRUNNER, HERBERT |
| 分类号 |
H01L33/48;H01L31/0203;H01S5/02 |
主分类号 |
H01L33/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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