MOULDED INTERCONNECT DEVICE WITH HEAT CONDUCTION PROPERTY AND MANUFACTURING METHOD THEREOF

摘要

A molded interconnect device (MID) with heat conduction property and a manufacturing method thereof are provided. The molded interconnect device includes a carrier component (220, 230), a heat conduction component (300) arranged in the carrier component for improving heat conduction property, and a metal layer (400) formed on a surface of the carrier component, wherein the carrier component can be a non-conductive carrier or a metallizable carrier. When a heat source is arranged on the metal layer, the heat generated from the heat source can be exhausted through the metal layer or the heat conduction component.