发明名称 BGA SOCKET WITH IMPROVED STRUCTURE
摘要 PURPOSE: A BGA(Ball Grid Array) socket with an improved structure is provided to improve productivity by preventing a defect of a socket. CONSTITUTION: A contact(200) includes a contact body(210), a pair of pin heads(220), and a pin leg(230). The pin head is extended from the upper side of the contact body. A center of the pin head is narrower than the upper and lower sides of the pin head. The upper side of the pin head is electrically contacted with a ball. The pin leg is extended from the lower side of the contact body.
申请公布号 KR20120055165(A) 申请公布日期 2012.05.31
申请号 KR20100116721 申请日期 2010.11.23
申请人 MICRO CONTACT SOLUTION CO., LTD. 发明人 WEE, SUNG YEP;KIM, HAN IL
分类号 H01R33/76;H01L23/32;H01R13/11 主分类号 H01R33/76
代理机构 代理人
主权项
地址