| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photocurable adhesive resin composition capable of securing high adhesion to various adherends such as a metal oxide, a metal or a resin, and a high glass transition temperature after curing, and improving an elastic modulus at room temperature. <P>SOLUTION: This composition contains a bifunctional urethane (meth)acrylate oligomer and a monomer component. The urethane (meth)acrylate oligomer contains a urethane prepolymer part comprising a polyol having an alkylene oxide chain and polyisocyanate, and a repeated number (n) of the urethane prepolymer part is 3-30, and the melting point of the polyisocyanate is >25°C. <P>COPYRIGHT: (C)2012,JPO&INPIT |
