| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer wiring body capable of manufacturing a multilayer wiring interlayer conductive path in a printing step. <P>SOLUTION: A multilayer wiring body comprises: first wiring formed on a base material; an interlayer connection part which connects the first wiring and second wiring formed on an upper layer of the first wiring; a first insulation layer which is formed on the base material and in which an opening is provided centered on the interlayer connection part; and a second insulation layer which is formed as a single pattern or a plurality of patterns around and centered on the interlayer connection part and at least a part of which is provided in the opening. The second wiring is formed on the interlayer connection part and the first insulation layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
