ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide an electronic component in which an adhesion strength between a chip element and an external electrode has been improved and a manufacturing method thereof.

SOLUTION: A manufacturing method of a multilayer chip inductor 10 comprises: a step of preparing a green multilayer ceramic substrate 14 on which a predetermined element structure 23 is internally formed; a step of forming a plurality of grooves 15 in which an internal surface 15a is roughened in parallel and at predetermined intervals on one surface of the green multilayer ceramic substrate 14; a step of filling each groove 15 with a conductor paste 17; a step of forming a plurality of electrode patterns 18 extending along each groove 15 so as to cover the surface of the conductor paste 17 filled in the groove 15; a step of cutting the green multilayer ceramic substrate 14 into chips along each groove 15; and a step of burning a ceramic chip 22 obtained as a result of cutting the green multilayer ceramic substrate 14 into chips.

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