发明名称 ATTACHING/REMOVING DEVICE, TEST HEAD, SEMICONDUCTOR TESTING DEVICE AND ATTACHING/REMOVING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an attaching/removing device capable of preventing a connector from being damaged in taking a substrate away from a test head. <P>SOLUTION: An attaching/removing device for attaching/removing a substrate 3 to/from a test head 11 comprises a fitting mechanism including a recess 33 provided on the substrate 3 and a projection member 23 provided on the test head; and a driving mechanism 24 for moving the projection member 23 in a direction vertical to the substrate 3. For releasing fit between a first connector 32 and a second connector 22 from a state where the first connector 32 and the second connector 22 are fit with each other, the projection member 23 is inserted into the recess 33, and with a fitting member 235 protruded beyond a side face of the projection member 23 fit in a hollow portion 331 of the recess 33, the driving mechanism 24 moves the projection member 23 in a direction where the substrate 3 is moved away from the test head 11, and the fit between the first connector 32 and the second connector 22 is thus released. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012103154(A) 申请公布日期 2012.05.31
申请号 JP20100252667 申请日期 2010.11.11
申请人 ADVANTEST CORP 发明人 DOI ATSUSHI
分类号 G01R31/26;G01R31/28;H01L21/66 主分类号 G01R31/26
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