| 发明名称 |
CURABLE RESIN COMPOSITION AND ELECTRIC AND ELECTRONIC PART USING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable resin composition which forms a resin cured product that undergoes a small dimensional change when coming into contact with oil, excels in stress relaxation property, and exhibits excellent cryogenic cycle durability. <P>SOLUTION: The curable resin composition includes an acrylonitrile butadiene rubber component-containing epoxy resin (A), an inorganic filler (B), a curing agent (C) and a reactive diluent (D), wherein the acrylonitrile butadiene rubber component-containing epoxy resin (A) is at least one selected from a group consisting of an epoxy resin mixed with acrylonitrile butadiene rubber and an epoxy resin modified with acrylonitrile butadiene rubber. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012102230(A) |
申请公布日期 |
2012.05.31 |
| 申请号 |
JP20100251762 |
申请日期 |
2010.11.10 |
| 申请人 |
HONDA MOTOR CO LTD;HENKEL JAPAN LTD |
发明人 |
NOGUCHI YASUSHI;CHIKUNO SHINGO;SHIOZAKI NORIYASU;SUZUKI ATSUHIKO |
| 分类号 |
C08L63/00;C08G59/20;C08G59/54;C08K3/00;C08L9/02;C09J11/04;C09J11/06;C09J109/02;C09J163/00;C09J165/00;C09K3/10;H01L23/29;H01L23/31 |
主分类号 |
C08L63/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
