Micromechanical device, has sense element and sensor chip that are arranged with each other, where electrical contact takes place by solder connection between contact surfaces of sense element and sensor chip

摘要

The device has a sense element (110) and a sensor chip (120) that are arranged with each other. The sense element comprises a contact surface (115) at a side that faces to the sensor chip. The sensor chip comprises a contact surface (125) on a top face in an upper area that faces to the sensor chip, where the contact surfaces are arranged to each other in a rectangular manner. An electrical contact between the sense element and the sensor chip takes place by a solder connection (130) between the contact surfaces of the sense element and the sensor chip. An independent claim is also included for a method for manufacturing a micromechanical device.