| 摘要 |
<p>A stacked cooler (24) has a plurality of refrigerant conduits (26), and a plurality of semiconductor modules (20,22). The refrigerant conduits (26) and the semiconductor modules (20,22) are alternately stacked, and both surfaces in the direction of stacking of the semiconductor modules (20,22) are in contact with the refrigerant conduits (26) and the semiconductor modules (20,22) are cooled. The semiconductor modules (20,22) are disposed singularly or multiply for each disposing space, respectively, such that the difference in heat release value for each disposing space adjoining with the refrigerant conduits (26) is reduced. This achieves equalization of cooling capacity in each disposing space, and enables waste due to excess cooling to be reduced.</p> |
