| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve cost reduction in bonding substrates and simplification of a manufacturing process in an electro-optical device, and also to suppress a light emitting element provided in an inside of an electro-optical device from being damaged due to heat when two sheets of substrates of the electro-optical device are bonded. <P>SOLUTION: A method for manufacturing an electro-optical device includes a step of bonding two sheets of substrates 110, 120. In the step, the two sheets of substrates 110, 120 are arranged to face each other so that each of sealing regions of the substrates is overlapped with each other, thereby forming a stacked substrate, and the both substrates are bonded by irradiating the sealing region of the stacked substrate with an ultrashort pulse laser beam to melt a glass substrate surface. <P>COPYRIGHT: (C)2012,JPO&INPIT |
