| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for tape application which applies a tape 30 without causing warpage of conductive base materials such as a lead frame 20 to which the tape 30 is applied, and to provide a method for tape application. <P>SOLUTION: An apparatus for tape application has application means which applies a tape 30 to a heated lead frame 20 by heating the tape 30 and preheating means 14 which is disposed at the upstream side in a tape conveyance direction relative to the application means and preheats the tape 30. <P>COPYRIGHT: (C)2012,JPO&INPIT |
