INTEGRATED CIRCUIT DEVICE WITH DIE BONDED TO POLYMER SUBSTRATE

摘要

An integrated circuit (IC) device (100) includes a polymer substrate (110) having a topside surface (111) and a bottomside surface (112) opposite the topside surface, a plurality of through- holes (113) that extend from the topside surface to the bottomside surface, and a plurality of bottom metal pads (119) on the bottomside surface positioned over the plurality of through-holes. At least one IC die (120) having an active topside (121) including a plurality of bond pads (124) and a second side (122) is affixed to the topside surface. Bonding features (118) are coupled to the plurality of bond pads for coupling respective ones of the plurality of bond pads to the plurality bottom metal pads. The bonding features extend into the through-holes to contact the bottom metal pads.