WIRE DISCHARGE APPARATUS AND SEMICONDUCTOR WAFER MANUFACTURING METHOD

摘要

A wire discharge apparatus is obtained that performs multiple cutting processes at the same time by winding a wire (3) between main guide rollers (1a to 1d) in multiple turns and is capable of performing a stable process while suppressing the vibrations of cutting wire portions (CL). In addition to the main guide rollers (1a to 1d), driven damping guide rollers (7a, 7b) or damping guides (21a, 21b) are provided that guide the wire (3) and form the cutting wire portions (CL), the vibrations of which are suppressed, and the positions of the cutting wire portions (CL) are specified with respect to nozzles (8a, 8b).