| 摘要 |
The invention relates to an LED module, comprising: - at least one LED chip (1) on a carrier (5), and - a prefabricated element (3) applied on the light emission surface of the LED chip (1), wherein scattering particles and colour conversion particles different therefrom in a matrix are accommodated in the element (3), wherein the concentration of the scattering particles decreases with a substantially constant first gradient from that side of the element (3) which faces the LED chip, and wherein the concentration of the colour conversion particles - in a first region, facing the LED chip, is substantially constant, in such a way that the colour conversion particles are packed in the densest possible fashion in this region, and - in a second region, adjoining the first region, falls abruptly with a second gradient, which is significantly greater than the first gradient of the scattering particles. |
