Multilayer ceramic device without structure of nickel plating and tin plating

摘要

A multilayer ceramic device (50) comprises a laminated ceramic body (60) having opposite end surfaces, a pair of conductive electrodes (70) each respectively attached to one end surface of the laminated ceramic body (60) and a plurality of alternately staggered internal electrodes (65) within the laminated ceramic body (60) configured in an alternating manner and each electrically connected to the corresponding conductive electrodes (70) respectively; each conductive electrodes (70) of the multilayer ceramic device (50) is further covered with a solder paste layer (72) so that the multilayer ceramic device (50) is thus made without any plating step and no need of treating waste liquid nickel or waste liquid tin as well as no problem of environmental pollution caused by plating solution, thereby lowering manufacturing costs and reducing processing time.