Power semiconductor

摘要

The system (100) has a wall element (20) provided with an outer side and an inner side, and a power semiconductor circuitry (30) arranged at the outer side. The inner side of the wall element forms a liquid or gas-tight wall of a line system (10). A metal mold body (40) includes a recess that is directly arranged adjacent to the wall element. A capacitor is cooled by the metal mold body, formed as an uncased capacitor. The capacitor is arranged in the recess by a spacer and a capping unit. The wall element is formed as a metallic heat sink.