发明名称 COMPRESSION MOUNT AND ZERO INSERTION FORCE SOCKET FOR IC DEVICES
摘要 In a socket system and method for coupling a pin of an IC (integrated circuit) device to a contact pad of a circuit board, a zif opening on a socket asserts substantially zero force as the pin of the IC device is inserted therein. In addition, a compression mount lead on the socket presses against the contact pad of the circuit board. Once inside the zif opening, the pin is coupled to the compression mount lead via forking leads that press against the pin. Thus, substantially zero force is applied on the body of the IC device. Furthermore, top portions of the forking leads contact a top portion of the pin toward the IC device to minimize an electrical path length.
申请公布号 KR101112045(B1) 申请公布日期 2012.05.30
申请号 KR20067001775 申请日期 2004.07.23
申请人 发明人
分类号 H01R12/71;H01R33/76;G01R1/04;H05K7/10 主分类号 H01R12/71
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