发明名称 Gold plating solution
摘要 <p>A gold plating bath and a plating method is disclosed where gold cyanide or salts thereof provide the source of gold, a cobalt compound, and a reaction product of compound containing at least a nitrogen-containing heterocyclic compound and an epihalohydrin. The gold plating bath has high deposition selectivity.</p>
申请公布号 EP2458036(A2) 申请公布日期 2012.05.30
申请号 EP20110190165 申请日期 2011.11.22
申请人 ROHM AND HAAS ELECTRONIC MATERIALS LLC 发明人 YOMOGIDA, KOICHI;KONDO, MAKOTO
分类号 C25D3/62 主分类号 C25D3/62
代理机构 代理人
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