| 摘要 |
<p>The method involves introducing process heat into vacuum chamber to heat workpiece with thermally active adhesive layer. The workpiece is provided with low load of about 2-10% of defined process load by pressing unit after introduction of workpiece into the vacuum chamber. The workpiece is maintained below the activation temperature of adhesive layer. The low load is removed from workpiece, and the workpiece is heated until activation temperature of adhesive layer is reached and is applied with process load.</p> |
