发明名称 |
LIGHT EMITTING DIODE PACKAGE MODULE |
摘要 |
PURPOSE: A light emitting diode package module is provided to be miniaturized and to reduce weight by omitting an optical device including a shield or a shade etc. CONSTITUTION: A light emitting diode package module(310) comprises a package substrate and light-emitting diode packages(311-313). The light-emitting diode packages are electrically connected with an external control circuit by a lead frame or a wire. A light emitting device emitting light is mounted on the package substrate. The light-emitting diode package comprises a lens(330) which is formed on the package substrate while covering the light emitting device. The lens controls a refractive index of the light in order to diffuse and concentrate the light. The lens is a concave lens or a convex lens.
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申请公布号 |
KR20120054429(A) |
申请公布日期 |
2012.05.30 |
申请号 |
KR20100115798 |
申请日期 |
2010.11.19 |
申请人 |
SAMSUNG LED CO., LTD. |
发明人 |
KIM, HONG MIN;PARK, HEE SEOK |
分类号 |
H01L33/58 |
主分类号 |
H01L33/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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