发明名称 LIGHT EMITTING DIODE PACKAGE MODULE
摘要 PURPOSE: A light emitting diode package module is provided to be miniaturized and to reduce weight by omitting an optical device including a shield or a shade etc. CONSTITUTION: A light emitting diode package module(310) comprises a package substrate and light-emitting diode packages(311-313). The light-emitting diode packages are electrically connected with an external control circuit by a lead frame or a wire. A light emitting device emitting light is mounted on the package substrate. The light-emitting diode package comprises a lens(330) which is formed on the package substrate while covering the light emitting device. The lens controls a refractive index of the light in order to diffuse and concentrate the light. The lens is a concave lens or a convex lens.
申请公布号 KR20120054429(A) 申请公布日期 2012.05.30
申请号 KR20100115798 申请日期 2010.11.19
申请人 SAMSUNG LED CO., LTD. 发明人 KIM, HONG MIN;PARK, HEE SEOK
分类号 H01L33/58 主分类号 H01L33/58
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