发明名称 |
LIGHT EMITTING DEVICE PACKAGE, BACKLIGHT UNIT, DISPLAY DEVICE AND LIGHTING DEVICE |
摘要 |
There is provided a light emitting device package including: a package body providing a chip mounting area and including first and second lead terminals; an LED chip mounted on the chip mounting area and electrically connected to the first and second lead terminals; a groove portion disposed around the LED chip in the chip mounting area; and a wavelength conversion portion formed of a resin containing a wavelength conversion material with which to enclose the LED chip and having an outer shape defined by the groove portion. |
申请公布号 |
EP2381495(A4) |
申请公布日期 |
2012.05.30 |
申请号 |
EP20090833664 |
申请日期 |
2009.12.21 |
申请人 |
SAMSUNG LED CO., LTD. |
发明人 |
JOO, SEONG-AH;LEE, HYO-JIN;PARK, IL-WOO;KIM, KYUNG-TAE |
分类号 |
H01L33/50;H01L33/52 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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