Electronics module, enclosure assembly housing same, and related systems and methods

摘要

Various embodiments of the invention relate to electronics modules, enclosure assemblies housing at least one such electronics module, and systems (e.g., missiles or unmanned vehicles) that may employ such enclosure assemblies. In one embodiment, an electronics module includes a first plate extending generally in a first plane, and a second plate spaced from the first plate and extending generally in a second plane. The electronics module further includes a plurality of electronic board assemblies each of which extends generally in a respective plane and is in thermal communication with at least one of the first and second plates. Each electronic board assembly may be positioned between the first and second plates and oriented so that the respective plane thereof is non-parallel relative to the first and second planes.