| 发明名称 |
Manufacturing method of a printed board assembly |
| 摘要 |
The present invention provides a printed wiring board assembly having active and passive components embedded between the printed wiring board layers and associated fabrication method so as to complete a multilayer printed wiring board to improve the flexibility of circuit layout. |
| 申请公布号 |
US8186042(B2) |
申请公布日期 |
2012.05.29 |
| 申请号 |
US20090387666 |
申请日期 |
2009.05.06 |
| 申请人 |
TEZAK TIMOTHY L.;LAPINSKI CRAIG F.;HINERMAN JAY B.;BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. |
发明人 |
TEZAK TIMOTHY L.;LAPINSKI CRAIG F.;HINERMAN JAY B. |
| 分类号 |
H05K3/36 |
主分类号 |
H05K3/36 |
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