发明名称 Metallic panel assembly having multilayer arrays of micropores
摘要 A metallic panel assembly having multilayer arrays of micropores includes a backlight module and a panel body. The backlight module is constituted of a first and a second light-guiding plate. First and second light-guiding microstructures are provided on the first and second light-guiding plates. A first and a second set of light-emitting units are disposed on one end of the first and second light-guiding plates, respectively. A first and a second shielding unit are disposed on the first and second light-guiding plates and the first and second sets of light-emitting units respectively. The panel body is disposed on one side surface of the first light-guiding plate. The panel body has thereon a plurality of hollowed portions with the hollowed portions encircling a key body. The key body has thereon a plurality of micropores. The plurality of micropores is arranged to form a pattern of each key body. When the first or second set of light-emitting units are lighted up, the light enters one side of the first or second light-guiding plate. The light is reflected by the first or second light-guiding microstructures on the corresponding key panel, so that the user can see the position of each key clearly.
申请公布号 US8186866(B2) 申请公布日期 2012.05.29
申请号 US20080018897 申请日期 2008.01.24
申请人 LIU CHANG-LI;WU CHE-TUNG;ICHIA TECHNOLOGIES, INC. 发明人 LIU CHANG-LI;WU CHE-TUNG
分类号 F21V8/00 主分类号 F21V8/00
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