| 摘要 |
PURPOSE: An image sensor module is provided to embody a high performance image sensor by including a video apparatus and an image sensor. CONSTITUTION: A sensor chip(10) includes a first surface(11), a second surface(12), and a sensor array unit(14). The first surface is faced with the second surface. A filter(20) is arranged on the optical path of the sensor array unit. The filter is contacted to the sensor chip. The filter and the sensor chip are integrated using a heat bonding method. The filter and the sensor chip are contacted each other through adhesives. The filter and the sensor chip are formed using a wafer.
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