发明名称 |
Method of manufacturing a circuit board |
摘要 |
A circuit board and a method of manufacturing the circuit board are provided. The method includes forming at least one protruded bump on a first side of a conductive board, forming a dielectric layer on the first side of the conductive board where the at least one bump is formed so as to cover the at least one bump; and etching a second side of the conductive board so as to partially remove the board to form a pattern. |
申请公布号 |
US8186043(B2) |
申请公布日期 |
2012.05.29 |
申请号 |
US20100891176 |
申请日期 |
2010.09.27 |
申请人 |
LEE SANG-MIN;KIM DEOK-HEUNG;NA DOC-HWA;SAMSUNG TECHWIN CO., LTD. |
发明人 |
LEE SANG-MIN;KIM DEOK-HEUNG;NA DOC-HWA |
分类号 |
H05K3/36 |
主分类号 |
H05K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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