发明名称 Embedded capacitor in semiconductor device and method for fabricating the same
摘要 A semiconductor device with an embedded capacitor structure. A dielectric layer is disposed on a substrate, having a contact opening exposing the substrate and a trench opening above the contact opening. A first metal electrode layer is conformally disposed over the sidewalls and bottoms of the contact and trench openings. A second metal electrode layer is conformally disposed over the sidewalls and bottoms of the contact and trench openings. A capacitor dielectric layer is interposed between the first and second metal electrode layers. A method for fabricating the semiconductor device is also disclosed.
申请公布号 US8188527(B2) 申请公布日期 2012.05.29
申请号 US20060422701 申请日期 2006.06.07
申请人 LIU MING-CHYI;LO CHI-HSIN;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 LIU MING-CHYI;LO CHI-HSIN
分类号 H01L27/108 主分类号 H01L27/108
代理机构 代理人
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