发明名称 Method for manufacturing semiconductor device and the semiconductor device
摘要 A method for manufacturing a semiconductor device which includes: alternately supplying a silicon source and an oxidant to deposit a silicon oxide film on a surface of a semiconductor substrate, wherein the silicon source is supplied under a supply condition where an adsorption amount of molecules of the silicon source on the semiconductor substrate is increased without causing an adsorption saturation of the molecules of the silicon source on the semiconductor substrate, and wherein the oxidant is supplied under a supply condition where impurities remain in the molecules of the silicon source adsorbed on the semiconductor substrate.
申请公布号 US8187973(B2) 申请公布日期 2012.05.29
申请号 US20090404832 申请日期 2009.03.16
申请人 SEKINE KATSUYUKI;YOSHINAGA KAZUHEI;KABUSHIKI KAISHA TOSHIBA 发明人 SEKINE KATSUYUKI;YOSHINAGA KAZUHEI
分类号 H01L21/44 主分类号 H01L21/44
代理机构 代理人
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