发明名称 LIGHT EMITTING DIODE CHIP HAVING ELECTRODE PAD
摘要 PURPOSE: A light emitting diode chip having an electrode pad is provided to prevent the reduction of a light emitting area by connecting an electrode extending part to a semiconductor layer through penetration holes. CONSTITUTION: A semiconductor stacked structure com a first electrical conduction semiconductor layer, a second electrical conduction semiconductor layer, and an active layer. A reflective insulating layer is located on the second electrical conduction semiconductor layer. A second electrode pad(39) is located on a partial domain of the reflective insulating layer. A transparent conductive layer(33) locates between the reflective insulating layer and the second electrode pad. The transparent conductive layer is connected to the second electrical conduction semiconductor layer. A second electrode extension part(39a) is extended from the second electrode pad and is located on the transparent conductive layer.
申请公布号 KR20120053990(A) 申请公布日期 2012.05.29
申请号 KR20120024507 申请日期 2012.03.09
申请人 SEOUL OPTO DEVICE CO., LTD. 发明人 KIM, YE SEUL;KIM, KYOUNG WAN;YOON, YEO JIN;LEE, JIN WOONG;JEONG, DA YEON;WOO, SANG WON
分类号 H01L33/36;H01L33/38;H01L33/46 主分类号 H01L33/36
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