A PRINTED CIRCUIT BOARD AND A FABRICATING METHOD THEREOF

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to obtain the adhesive force between a conductive layer and an insulating layer by obtaining uniform illuminance on an insulating layer. CONSTITUTION: An insulating layer is formed on a core substrate having an internal circuit pattern(S100). Illuminance is formed on a surface of the insulating layer(S200). A via hole is formed on the insulating layer(S300) A metal coating layer is formed on the insulating layer(S400) A step forming the illuminance on the insulating layer surface includes a step(S210) attaching a metal foil to the insulating layer and a step(S220) removing the metal foil by etching the metal foil. The insulating layer having the uniform surface illuminance of a nano size is formed on the core substrate including the first circuit pattern. A second circuit pattern is formed on the insulating layer by plating.