发明名称 |
Printed wiring board and method for manufacturing printed wiring board |
摘要 |
A printed wiring board and a method for manufacturing the same are provided. The printed wiring board includes a resin insulation layer having a first surface and a second surface opposite the first surface, and includes an opening for a first via conductor. An electronic-component mounting pad is formed on the first surface of the resin insulation layer. The electronic-component mounting pad includes a portion embedded in the resin insulation layer and a portion protruding from the resin insulation layer. The protruding portion covers the embedded portion and a portion of the first surface of the resin insulation layer that surrounds the embedded portion. A first conductive circuit is formed on the second surface of the resin insulation layer. A first via conductor is formed in the opening of the resin insulation layer and connects the electronic-component mounting pad and the first conductive circuit. |
申请公布号 |
US8188380(B2) |
申请公布日期 |
2012.05.29 |
申请号 |
US20090610526 |
申请日期 |
2009.11.02 |
申请人 |
KAWAI SATORU;SAKAI KENJI;CHEN LIYI;IBIDEN CO., LTD. |
发明人 |
KAWAI SATORU;SAKAI KENJI;CHEN LIYI |
分类号 |
H01L29/40;H01L29/47 |
主分类号 |
H01L29/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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