发明名称 APPARATUS FOR CHUCKING SUBSTRATE
摘要 PURPOSE: A substrate chucking device is provided to simplify an apparatus for processing a substrate by stably supporting the substrate with a mask and to support the substrate to be steadily transferred. CONSTITUTION: A substrate comprises a first flat board(110), a second flat board(130), and a third flat board(150). The third flat board is arranged between the first flat board and the second flat board. The second flat board is separated from the first flat board. A vacuum groove(115) is formed on one side of the first flat board and sticks the substrate to one side of the first flat board. A connection hole passes through the first flat board and the second flat board and is communicated with the vacuum groove. A supporting member supports the first flat board from the second flat board.
申请公布号 KR20120054003(A) 申请公布日期 2012.05.29
申请号 KR20120048124 申请日期 2012.05.07
申请人 LIGADP CO., LTD. 发明人 SON, HYOUNG KYU;CHOI, EUN YOUL;KIM, SANG LEOUL;LEE, JAE MOO;KANG, CHAN HO
分类号 H01L21/683;B65G49/06;H01L21/687;H05K13/04 主分类号 H01L21/683
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