发明名称 |
APPARATUS FOR CHUCKING SUBSTRATE |
摘要 |
PURPOSE: A substrate chucking device is provided to simplify an apparatus for processing a substrate by stably supporting the substrate with a mask and to support the substrate to be steadily transferred. CONSTITUTION: A substrate comprises a first flat board(110), a second flat board(130), and a third flat board(150). The third flat board is arranged between the first flat board and the second flat board. The second flat board is separated from the first flat board. A vacuum groove(115) is formed on one side of the first flat board and sticks the substrate to one side of the first flat board. A connection hole passes through the first flat board and the second flat board and is communicated with the vacuum groove. A supporting member supports the first flat board from the second flat board.
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申请公布号 |
KR20120054003(A) |
申请公布日期 |
2012.05.29 |
申请号 |
KR20120048124 |
申请日期 |
2012.05.07 |
申请人 |
LIGADP CO., LTD. |
发明人 |
SON, HYOUNG KYU;CHOI, EUN YOUL;KIM, SANG LEOUL;LEE, JAE MOO;KANG, CHAN HO |
分类号 |
H01L21/683;B65G49/06;H01L21/687;H05K13/04 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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