| 摘要 |
PURPOSE: An electroplating solution and an electroplating method for semiconductors are provided to bury copper in a groove or hole through electroplating without voids. CONSTITUTION: An electroplating solution for semiconductors comprises hydrogen atom or methyl, an element selected from lithium, sodium, and potassium, or ammonium or univalent aluminum. The electroplating solution also includes polyethylene glycol or the copolymer compound of polyethylene oxide and propylene oxide.
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