| 摘要 |
A chip-on-glass panel device includes a glass substrate having a pixel area, an integrated circuit area, and a fan out area, the fan out area located between the pixel area and the IC area, a plurality of integrated circuit devices arranged within the integrated area of the glass substrate, each of the plurality of integrated circuit devices have an active surface, a plurality of output pads, each arranged on the active surface, and a plurality of signal pads/gamma pads, each arranged on the active surface, and a plurality of signal wires/gamma wires, each having a curved shape geometry and disposed within the fan out area, for connecting the plurality of signal pads/gamma pads of adjacent ones of the plurality of integrated circuit devices through the fan out area. |
