发明名称 Direct illumination machine vision technique for processing semiconductor wafers
摘要 A vision system is provided to determine a positional relationship between a semiconductor wafer on a platen and an element on a processing machine, such as a printing screen, on a remote side of the semiconductor wafer from the platen. A source directs ultraviolet light through an aperture in the platen to illuminate the semiconductor wafer and cast a shadow onto the element adjacent an edge of the semiconductor wafer. A video camera produces an image using light received from the platen aperture, wherein some of that received light was reflected by the wafer. The edge of the semiconductor wafer in the image is well defined by a dark/light transition.
申请公布号 US8189194(B2) 申请公布日期 2012.05.29
申请号 US20080209248 申请日期 2008.09.12
申请人 SCHWAB JOHN W.;LIU GANG;MICHAEL DAVID J.;WANG LEI;COGNEX CORPORATION 发明人 SCHWAB JOHN W.;LIU GANG;MICHAEL DAVID J.;WANG LEI
分类号 G01B11/00 主分类号 G01B11/00
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