发明名称 |
Electronic device including a conductive structure extending through a buried insulating layer |
摘要 |
An electronic device can include a substrate, a buried insulating layer overlying the substrate, and a semiconductor layer overlying the buried insulating layer, wherein the semiconductor layer is substantially monocrystalline. The electronic device can also include a conductive structure extending through the semiconductor layer and buried insulating layer and abutting the substrate, and an insulating spacer lying between the conductive structure and each of the semiconductor layer and the buried insulating layer. |
申请公布号 |
US8188543(B2) |
申请公布日期 |
2012.05.29 |
申请号 |
US20060556576 |
申请日期 |
2006.11.03 |
申请人 |
ROGGENBAUER TODD C.;KHEMKA VISHNU K.;ZHU RONGHUA;BOSE AMITAVA;HUI PAUL;HUANG XIAOQIU;FREESCALE SEMICONDUCTOR, INC. |
发明人 |
ROGGENBAUER TODD C.;KHEMKA VISHNU K.;ZHU RONGHUA;BOSE AMITAVA;HUI PAUL;HUANG XIAOQIU |
分类号 |
H01L27/01 |
主分类号 |
H01L27/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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