LAMINATED STRUCTURE FOR A FLEXIBLE CIRCUIT BOARD HAVING A IMPROVED HEAT RESISTANCE ADHESIVE STRENGTH AND MANUFACTURING METHOD THE SAME

摘要

PURPOSE: A copper foil laminated structure for a flexible circuit board having improved heat resistant adhesive strength and a manufacturing method thereof are provided to prevent a copper oxide film from being formed on a polyimide interface corresponding to a base film by forming a specific buffer layer between a tie layer and a seed layer. CONSTITUTION: A polyimide film is used as a base film(1). An Ni-Cr(Nickel Chromium) alloy layer corresponding to a tie layer(2), an ITO layer corresponding to a buffer layer(3), and a seed layer(4) which sputters copper on a conductive layer, are laminated on the polyimide film. A copper plated layer(5) is laminated since electroplating is used on a laminated structure. Polyimide corresponding to the base film is surface-treated by RF plasma for improving an adhesive force in vacuum.