| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC module and a manufacturing method thereof, and an embedded printed circuit board using an IC module and a manufacturing method thereof. SOLUTION: An IC module includes: a chip 11 on whose top face an electrode pad is formed; a protective layer 13 having a hole 15 formed by patterning and formed on the whole area of the chip 11; a copper seed layer 17 formed on the whole area of the protective layer 13 on which the hole 15 is provided; a rewiring layer 19 formed at a part of the top face of the copper seed layer 17; a plating layer 21 formed on the top face of the rewiring layer 19 and on the whole area of the copper seed layer 17 on which no rewiring layer 19 is formed. COPYRIGHT: (C)2012,JPO&INPIT
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