| 摘要 |
PURPOSE: A lead-free frit composition for low-temperature sealing and a lead free paste composition manufacturing method including thereof are provided to effectively control coefficient of thermal expansion by including filler which has coefficient of thermal expansion. CONSTITUTION: A lead-free frit composition for low-temperature sealing comprises 17-27 weight% of P2O5, 55-70 weight% of V2O5, 1-5 weight% of Sb2O3, 0.5-3 weight% of MoO3, 1-5 weight% of K2O, 0.5-3 weight% of Li2O, 0.5-3 weight% of SrO, 0.5-3 weight% of TeO2, 0.5-3 weight% of Ag2O, 0.5-3 weight% of Cs2O, and 0.5-3 weight% of glass frit. The composition has a transition point of 300-320 deg. Celsius, a strain point of 330-350 deg. Celsius. A lead free paste composition manufacturing method comprises the following steps: adding 5-25 parts by weight of LAS(eucryptite, spodumene) filler which has negative coefficient of thermal expansion based on 100.0 parts by weight of a glass made of lead-free frit composition for low-temperature sealing; and including 10-20 parts by weight of vehicle which includes organic binder and solvent. |
