METHOD AND COMPOSITIONS FOR DIRECT COPPER PLATING AND FILLING TO FORM INTERCONNECTS IN THE FABRICATION OF SEMICONDUCTOR DEVICES,申请号HK20090110639-传众专利搜索

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发明名称	METHOD AND COMPOSITIONS FOR DIRECT COPPER PLATING AND FILLING TO FORM INTERCONNECTS IN THE FABRICATION OF SEMICONDUCTOR DEVICES
摘要
申请公布号	HK1132768(A1)	申请公布日期	2012.05.25
申请号	HK20090110639	申请日期	2009.11.13
申请人	ALCHIMER	发明人	GONZALEZ, JOSE;MONCHOIX, HERVE
分类号	C25D	主分类号	C25D
代理机构		代理人
主权项
地址

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