| 摘要 |
PURPOSE: A solder transfer device and a solder transfer method using the same are provided to transfer solders inserted into a template on an accurate location of a bump pad formed on a substrate, thereby increasing the quality of a semiconductor device. CONSTITUTION: A support part(100) supports a template(10) loaded from the outside. A pressurization unit(200) faces the support part. The pressurization unit absorbs a substrate(20) using vacuum power. A sensing unit(300) senses an offset load value applied to at least three spots of the support part. A pressure controller(400) controls the pressure between the support unit and the pressurization unit according to the offset load value.
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