| 摘要 |
A wafer processing method for a gallium nitride bulk is provided to improve a wafer processing efficiency by joining a plurality of the gallium nitride rear films into the bulk type and multiple-cutting the rear films. A gallium nitride bulk(150) is formed by arranging and joining a plurality of gallium nitride rear films. The joined gallium nitride bulk is cut into the plurality of gallium nitride films by a multiple cutting device like a plurality of wire saws. The gallium nitride is coupled through at least one dummy plate.
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