| 摘要 |
Optocoupler devices and methods for making and using such devices are described. The optocoupler devices contain a light emitting component (a light emitting diode [LED]) and a light receiving component (a phototransistor [PT]) device that are embedded within the substrate, rather than being attached to the surface of the pre-molded substrate. Such a configuration eliminates the bond wires that are often used when the LED and PT are attached on the substrate, improves the electrical performance, and allows the final optocoupler package to be made smaller and thinner. Other embodiments are described. |
