| 摘要 |
PURPOSE: A substrate inspecting apparatus is provided to enable the detection of short fault due to foreign materials on a substrate surface below a chip by the application of current on the lower surface of the substrate. CONSTITUTION: A substrate inspecting apparatus comprises a clamp(10), a plurality of pins(20), a current supply unit(30), and a metal tag(40). The clamp supports a printed circuit board. A plurality of pins is attached to each spot of a chip mounted in the printed circuit board and applies current. The current supply unit is electrically connected to the clamp and a plurality of pins and supplies current. The metal tag is attached to the clamp and is contacted with the lower surface of the supported printed circuit board.
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