发明名称 |
METHOD OF FORMING MICRO-ELECTRO-MECHANICAL-SYSTEM (MEMS) DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of forming a MEMS device. <P>SOLUTION: The method of forming a MEMS device (10) includes a step of forming a sacrificial layer (34) over a substrate (12). The method further includes a step of forming a metal layer (42) over the sacrificial layer (34) and a step of forming a protection layer (44) overlying the metal layer (42). The method further includes a step of etching the protection layer (44) and the metal layer (42) to form a structure (56) having a remaining portion of the protection layer formed over a remaining portion of the metal layer. The method further includes a step of etching the sacrificial layer (34) to form a movable portion of the MEMS device, wherein the remaining portion of the protection layer protects the remaining portion of the metal layer during the step of etching of the sacrificial layer to form the movable portion of the MEMS device (10). <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012096350(A) |
申请公布日期 |
2012.05.24 |
申请号 |
JP20110216769 |
申请日期 |
2011.09.30 |
申请人 |
FREESCALE SEMICONDUCTOR INC |
发明人 |
KARLIN LISA H;KIERST DAVID W;LIU LIANJUN;LIU WEI;MONTEZ RUBEN B;STEIMLE ROBERT F |
分类号 |
B81C1/00 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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