| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an ultrasonic packaging tool which is adapted to shorten the tact time when a semiconductor chip is packaged by reducing the weight of a horn. <P>SOLUTION: The ultrasonic packaging tool comprises a horn 22 having a square cross-sectional shape which is formed in hollow shape having four sidewalls by through holes 22b extending in the axial direction and internally provided with a core 22c extending in the axial direction integrally with the sidewalls, a vibrator 23 connected to one end of the horn in the axial direction and causing ultrasonic vibration of the horn in the axial direction, and a tool 24 for holding a semiconductor chip provided at a part of one of four external surfaces of the horn where the vibration is maximized. <P>COPYRIGHT: (C)2012,JPO&INPIT |
