| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board capable of preventing warpage of a wiring substrate by relaxing the difference in shrinkage factor between a primary surface side of a substrate on which a chip component is mounted and an opposite rear surface side of the substrate. <P>SOLUTION: A multilayer wiring board 10 includes a primary surface 11 of a substrate and a rear surface 12 of the substrate, and has a structure in which a plurality of resin insulating layers 21 to 27 and a plurality of conductor layers 31 to 38 are stacked. The plurality of conductor layers 35 to 38 provided on the rear surface 12 side of the substrate with reference to the resin insulating layer 24 as the center layer are formed so that the average area ratio of the layers is higher than that of the plurality of conductor layers 31 to 34 provided on the primary surface 11 side of the substrate. The plurality of resin insulating layers 25 to 27 provided on the rear surface 12 side of the substrate are formed so that the average thickness of the layers is greater than that of the plurality of resin insulating layers 21 to 23 provided on the primary surface 11 side of the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
