| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a package substrate and a method of manufacturing the same. <P>SOLUTION: A core substrate 1 is obtained by arranging copper foils 3 having a size smaller than that of a copper-clad lamination plate 2 on both sides of the copper-clad lamination plate 2, and the substrate is defined as a first circuit substrate 10. Next, an insulation resin layer 4 and a copper foil 5 to be an outer layer are laminated on an adhesion structure. This substrate is defined as a second circuit substrate 20. A conformal mask is formed on the copper foil 5 to obtain a third circuit substrate 30. A non-penetrating hole is formed to obtain a forth circuit substrate 40. The non-penetrating hole is plated with copper and brought into conduction to obtain a fifth circuit substrate 50. The copper-clad lamination plate 2 as a supporting body is removed by cutting the fifth circuit substrate 50 so as to have a size smaller than that of the copper foil 3 to obtain a sixth circuit substrate 60. The wires are etched to obtain a seventh circuit substrate 70. Solder resist formation and gold plating finishing are performed to obtain an eighth circuit substrate 80. <P>COPYRIGHT: (C)2012,JPO&INPIT |
